Principal Engineer Packaging Engineering
Principal Engineer Packaging Engineering
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Salary Not Disclosed
1 Vacancy
Job Description
As a Packaging Engineer you will work in the Packaging R&D group on the modeling and simulation design of experiment and testing across semiconductor packaging flash memory product and host levels.
ESSENTIAL DUTIES AND RESPONSIBILITIES:
- Responsible for influencing package and product design by addressing the structural integrity and reliability issues in particular and advancing the technology of semiconductor packaging in general. The scope is to address all mechanical aspects of packaging technology and associated material and process interactions. The focus will be on solutions to meet increased demands for small form factor packages with thinner chips denser interconnects higher power and higher reliability (under harsh use conditions such as automotive).
- Responsible for the modeling and simulation design of experiment and testing whichever comes first for best engineering practice of mechanical responses of IC package and flash products including solid state drives.
- This position will interface with package & product design electrical and physical characterization reliability testing failure analysis assembly R&D and other process teams.
- Solid background in applied mechanics especially computational and/or experimental solid mechanics is required. Indepth knowledge of IC packaging is highly desired.
Qualifications :
REQUIRED:
- Ph.D. in Mechanical Engineering plus >3 years or M.S. in Mechanical Engineering plus >5 years of relevant industrial experience.
- Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.
- Strong background in computational solid mechanics and/or experimental solid mechanics with emphasis on failure analysis and design of experiment.
- Broad knowledge of mechanical behaviors of various material types including composite laminates polymers and metals (e.g. solder).
- Working knowledge in designing and conducting mechanical testing and/or using a commercial FEA package.
- Good understanding of general semiconductor packaging processes materials technology and trends such as substrate design and manufacturing molding wirebonding die attach flip chip TSV hybrid bonding etc.
SKILLS:
- Strong oral and written communication skills.
- Demonstrated strong work ethic.
- Ability to work in a global team environment and interact with other engineers to define and implement experiments and conduct relevant simulation for feasibility and validation of concepts and provide design solutions to support new package technology development.
Additional Information :
Western Digital is committed to providing equal opportunities to all applicants and employees and will not discriminate against any applicant or employee based on their race color ancestry religion (including religious dress and grooming standards) sex (including pregnancy childbirth or related medical conditions breastfeeding or related medical conditions) gender (including a persons gender identity gender expression and genderrelated appearance and behavior whether or not stereotypically associated with the persons assigned sex at birth) age national origin sexual orientation medical condition marital status (including domestic partnership status) physical disability mental disability medical condition genetic information protected medical and family care leave Civil Air Patrol status military and veteran status or other legally protected characteristics. We also prohibit harassment of any individual on any of the characteristics listed above. Our nondiscrimination policy applies to all aspects of employment. We comply with the laws and regulations set forth in the Know Your Rights: Workplace Discrimination is Illegal poster. Our pay transparency policy is available here: Pay Transparency Nondiscrimination Provision (dol.gov)
Western Digital thrives on the power and potential of diversity. As a global company we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees our company our customers and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging respect and contribution.
Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at to advise us of your accommodation request. In your email please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
ased on our experience we anticipate that the application deadline will be 01/08/2025 (3 months from posting) although we reserve the right to close the application process sooner if we hire an applicant for this position before the application deadline. If we are not able to hire someone from this role before the application deadline we will update this posting with a new anticipated application deadline.
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Compensation & Benefits Details
- An employees pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills ability knowledge of the job; (3) performance contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs.
- The salary range is what we believe to be the range of possible compensation for this role at the time of this posting. We may ultimately pay more or less than the posted range and this range is only applicable for jobs to be performed in California Colorado New York or remote jobs that can be performed in California Colorado and New York. This range may be modified in the future.
- You will be eligible to participate in Western Digitals ShortTerm Incentive (STI) Plan which provides incentive awards based on Company and individual performance. Depending on your role and your performance you may be eligible to participate in our annual LongTerm Incentive (LTI) program which consists of restricted stock units (RSUs) or cash equivalents pursuant to the terms of the LTI plan. Please note that not all roles are eligible to participate in the LTI program and not all roles are eligible for equity under the LTI plan. RSU awards are also available to eligible new hires subject to Western Digitals Standard Terms and Conditions for Restricted Stock Unit Awards.
- We offer a comprehensive package of benefits including paid vacation time; paid sick leave; medical/dental/vision insurance; life accident and disability insurance; taxadvantaged flexible spending and health savings accounts; employee assistance program; other voluntary benefit programs such as supplemental life and AD&D legal plan pet insurance critical illness accident and hospital indemnity; tuition reimbursement; transit; the Applause Program employee stock purchase plan and the Western Digital Savings 401(k) Plan.
- Note: No amount of pay is considered to be wages or compensation until such amount is earned vested and determinable. The amount and availability of any bonus commission benefits or any other form of compensation and benefits that are allocable to a particular employee remains in the Companys sole discretion unless and until paid and may be modified at the Companys sole discretion consistent with the law.
Remote Work :
No
Employment Type :
Fulltime
Employment Type
Full-time
