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PLP- Advanced Packaging RD Engineer - Work In Taiwan
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PLP- Advanced Packag....
drjobs PLP- Advanced Packaging RD Engineer - Work In Taiwan العربية

PLP- Advanced Packaging RD Engineer - Work In Taiwan

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1 Vacancy
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Job Location

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Taipei - Taiwan

Monthly Salary

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Not Disclosed

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Salary Not Disclosed

Vacancy

1 Vacancy

Job Description

Req ID : 2675931

As a PLP Advanced Packaging R&D Engineer you will be responsible for driving research and development initiatives focused on advancing PLP backend processes equipment and material technologies. Your role will involve conducting evaluations of new products and integrating cuttingedge technologies to enhance our advanced packaging solutions.

Key Responsibilities:

  1. PLP Backend Process/Equipment/Material Technology Development:

    • Lead R&D efforts to develop and optimize PLP backend processes including wafer grinding wafer cutting laser cutting ball mounting die bonding molding and laser marking.
    • Collaborate with crossfunctional teams to identify areas for improvement and develop innovative solutions to enhance process efficiency yield and reliability.
    • Evaluate and implement advanced equipment and materials to stay at the forefront of technology in the semiconductor packaging industry.
    • Conduct feasibility studies and process simulations to assess the viability and scalability of new technologies and processes.
  2. New Product Evaluation and Integrated Technology Development:

    • Evaluate new products and materials for compatibility with existing processes and equipment.
    • Drive integrated technology development initiatives to incorporate new advancements into our packaging solutions.
    • Collaborate with product development teams to ensure the successful integration of new technologies into product designs.
    • Conduct thorough testing and validation of integrated technologies to ensure performance and reliability meet or exceed industry standards.

Qualifications:

  • Bachelors degree in Engineering Materials Science or related field; Masters or Ph.D. preferred.
  • years of experience in semiconductor packaging R&D with a focus on backend processes and equipment development.
  • Indepth knowledge of PLP backend processes including wafer grinding cutting bonding molding and marking.
  • Experience with advanced packaging materials equipment and technologies.
  • Strong analytical and problemsolving skills with the ability to drive innovation and continuous improvement.
  • Excellent communication and collaboration skills with the ability to work effectively in crossfunctional teams.
  • Proven track record of successfully leading R&D projects from conception to implementation.
  • Experience with technology transfer and scaleup from R&D to production is desirable.

Remote Work :

No

Employment Type

Full Time

Company Industry

About Company

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