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You will be updated with latest job alerts via email Packaging Development Engineer for MEMS products
Package design and process development in cooperation with supplier and product engineering team for electronic sensors.
Developing solutions for assembly processes of MEMS for automotive and consumer application.
Coordination of sample manufacturing at assembly partner.
Team work in English language with a multitude of international interfaces is mandatory.
Qualifications :
38 Years experience in packaging/assembly of semiconductors components especially familiar with LGA BGA and WLCSP packages
Preferred Solid technical background in assembly technology
Passion for developing technical solutions in multidisciplinary international projects
Experience in international corporation
Ability to travel
Very good English skills
Good team work with multitude of international interfaces
Remote Work :
No
Employment Type :
Fulltime
Full-time