Define and implement comprehensive validation methodologies that guarantee our products meet both component and systemlevel product requirements
Collaborate with Design Engineering to bring up cuttingedge silicon photonic and laser products troubleshooting and resolving any technical issues that arise Establish a proactive customer support platform
Validate Component and System Performance
Drive Continuous Improvement and Lead New Product Introduction (NPI)
Deliver CustomerReady Documentation and Make Critical Decisions
Develop Test Software and Infrastructure and Ensure Timely Delivery
Experience:
2 to 5 years of experience
Industry experience in semiconductor laser & photonic devices system test & validation
Experience with component and system test equipment (BERT DCA OSA etc.) and standard signal quality metrics (TDECQ SRS URS)
Comprehensive knowledge of communication protocols and standards (Ethernet PCIe etc.).
Experience with system and subsystem test equipment (BERT DCA OSA etc.) and standard signal quality metrics (TDECQ SRS URS).
Experience in highspeed SerDes and their system validation & optimization.
Proficient in programming languages such as C C Python and Shell scripts
Knowledge of optical transceiver packaging and integration challenges
Collaborate with Design Package and Reliability Engineering to ensure a smooth and successful transition of products from development to mass production.
Collaborate with multidisciplinary teams to identify and implement product improvements through Automatic Test Equipment (ATE) bench characterization and other techniques.
Perform rigorous design validation on new chips and products through electrical and optical characterization of VLSI integrated circuits and optoelectronic systems.
Able to analyze complex technical problems identify root causes and develop effective solutions.
Experience with SoC validation planning bringup debugging and optimization.
Experience with highspeed SerDes and their characterization and optimization.
Knowledge of optical transceiver packaging and integration challenges.
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