drjobs
Engineer- Work In Taiwan
drjobs
Engineer- Work In Ta....
drjobs Engineer- Work In Taiwan العربية

Engineer- Work In Taiwan

Employer Active

1 Vacancy
drjobs

Job Alert

You will be updated with latest job alerts via email
Valid email field required
Send jobs
drjobs

Job Alert

You will be updated with latest job alerts via email

Valid email field required
Send jobs

Job Location

drjobs

Taipei - Taiwan

Monthly Salary

drjobs

Not Disclosed

drjobs

Salary Not Disclosed

Vacancy

1 Vacancy

Job Description

Req ID : 2729660

We are hiring for total 20 headcounts of Engineer(E&E Software Chemistry background). Successful candidate will based to work in Taiwan.

Job Scope (Semiconductor):

As a R&D Engineer in semiconductor industry you will be integral to advancing our FOPLP semiconductor packaging solutions. Your primary responsibilities will include evaluating PLP packaging designs simulating product performance designing PLP layouts and project management. Successful hired candidate will be assigned to work in Taiwan!

Key Responsibilities:

  • Evaluation of PLP Packaging Designs: Assess and evaluate various PLP packaging designs to ensure they meet production requirements performance specifications and industry standards.
  • Product Simulation: Utilize simulation tools and techniques to analyze and predict the performance characteristics of PLP semiconductor packages under different operating conditions and environments
  • PLP Layout Design: Collaborate with crossfunctional teams to design and optimize PLP layouts considering factors such as signal integrity thermal management and manufacturability.
  • Project Management: Lead and manage projects related to packaging design ensuring adherence to timelines budgets and quality standards. Coordinate with internal and external stakeholders to drive project success.

Job Scope (Automotive):

As an R&D Engineer in the automotive industry you will lead the planning research and development of new technologies for automotive systems particularly focusing on integrated design material optical properties evaluation electronic system integration and innovative panel development. Additionally you will foster crosscompany and industryacademia technology cooperation to drive collaborative advancements in automotive display and user interface solutions for future technology roadmaps. Successful hired candidate will be assigned to work in Taiwan!

Key Responsibilities:

  • Lead the integrated design of automotive systems ensuring compatibility functionality and performance across components and subsystems.
  • Evaluate the optical properties of materials used in automotive systems including displays panels and interfaces to optimize visual clarity durability and user experience.
  • Design and develop integrated automotive electronic systems incorporating advanced functionalities connectivity and compatibility with emerging technologies.
  • Spearhead the development of new technologies for automotive panels exploring innovative materials manufacturing processes and design approaches to enhance aesthetics functionality and durability.
  • Foster crosscompany and industryacademia technology cooperation initiatives establishing partnerships collaborative projects and knowledgesharing platforms to drive innovation and address industry challenges.
  • Conduct comprehensive research and analysis of automotive display and user interface solutions identifying trends opportunities and potential areas for technological advancement.
  • Collaborate with internal teams external partners and research institutions to leverage expertise resources and capabilities in support of R&D objectives.
  • Develop and maintain a technology roadmap for automotive display and user interface solutions outlining shortterm and longterm goals milestones and strategic initiatives.
  • Stay updated on industry trends emerging technologies and competitive landscape providing insights and recommendations to inform R&D strategies and priorities.
  • Communicate effectively with stakeholders presenting R&D findings progress updates and recommendations for decisionmaking and investment.

Qualifications:

  • Bachelors degree in Electrical Engineering Mechanical Engineering or related field. Masters degree preferred.
  • Minimum of 3 years of experience in semiconductor packaging or automotive design with a focus on panel level packaging for Bachelor Degree.
  • Fresh Graduate/less then 2 years working experience of Master Degree candidate are welcome to join.
  • Proficiency in packaging design evaluation product simulation and layout design.
  • Strong project management skills with experience leading crossfunctional teams and managing projects from inception to completion.
  • Familiarity with industrystandard design tools and simulation software.
  • Excellent communication and interpersonal skills with the ability to collaborate effectively across multidisciplinary teams.
  • Analytical mindset with a focus on problemsolving and continuous improvement.
  • Ability to thrive in a fastpaced dynamic environment and adapt to changing priorities.

Remote Work :

No

Employment Type

Full Time

Company Industry

About Company

Report This Job
Disclaimer: Drjobpro.com is only a platform that connects job seekers and employers. Applicants are advised to conduct their own independent research into the credentials of the prospective employer.We always make certain that our clients do not endorse any request for money payments, thus we advise against sharing any personal or bank-related information with any third party. If you suspect fraud or malpractice, please contact us via contact us page.