PCB Design Engineer
PCB Design Engineer
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1 Vacancy
Job Description
Role: PCB Design Engineer
Location: Santa Clara CA Day 1 Onsite)
Type: Fulltime/Contract to hire and subcon
Job Description: Senior Electrical Engineer Advanced Semiconductor Packaging and Integration
Position Overview
We are seeking a highly experienced Senior Product Lead with a robust background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will possess extensive knowledge in mixedsignal design chiplet design and advanced packaging. This role demands a deep understanding of both BEOL and FEOL semiconductor processing as well as current packaging and substrate technologies for advanced packaging.
Responsibilities
Lead the design and development of advanced semiconductor electronics and ASICs ensuring high performance and reliability.
Develop and optimize mixedsignal designs balancing analogue and digital circuit requirements.
Oversee semiconductor processing and advanced packaging technologies to enhance device performance and manufacturability.
Integrate High Bandwidth Memory (HBM) and Low Power Double Data Rate (LPDDR) memory into system designs for improved efficiency and speed.
Implement chiplet integration techniques focusing on highspeed chiplet I/O and interconnects.
Ensure signal integrity and power integrity throughout the design and development process.
Automate chip layout generation and format conversion to streamline design workflows.
Design printed circuit boards (PCBs) with a focus on performance reliability and manufacturability.
Conduct thermal simulations to optimize thermal management and ensure device reliability under various operating conditions.
Collaborate with crossfunctional teams to ensure seamless integration and timely delivery of projects.
Mentor and guide junior engineers fostering a culture of continuous learning and innovation.
Requirements
M.S in Electrical Engineering Computer Engineering or a related field.
Extensive experience in advanced semiconductor electronics and ASIC design.
Proficiency in mixedsignal design and semiconductor processing techniques.
Strong knowledge of advanced packaging technologies including HBM and LPDDR integration.
Experience with chiplet integration highspeed chiplet I/O and interconnects.
Expertise in signal integrity power integrity and automated chip layout generation.
Proven track record in PCB design and thermal simulations.
Published works or patents in semiconductor technologies are highly desirable.
Excellent leadership communication and project management skills.
Ability to work collaboratively in a fastpaced and dynamic environment.
Preferred Qualifications
Ph.D. in a relevant field.
Experience with leading industrystandard design and simulation tools.
Published works or patents in semiconductor technologies.
Excellent leadership communication and project management skills.
Additional Information :
All your information will be kept confidential according to EEO guidelines.
Remote Work :
No
Employment Type :
Contract
Employment Type
Contract
