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1 Vacancy
Development engineering for MEMS packages
Package design and Development of assembly process for MEMS devices in cooperation with supplier and product engineering team
Providing solutions for assembly process and materials of automotive and consumer sensor products
Project coordination for Development activities and sample manufacturing
Qualifications :
Bachelor or above degree in Electronic / Material Engineering
38 Years experience in packaging/assembly/test of semiconductors
Experience in international corporation
Knowledge in machines and processes used in assembly technologies
Ability to travel
Very good English skills
Good team work with multitude of international interfaces
Additional Information :
By choice we are committed to a diverse workforce EOE/Protected Veteran/Disabled.
Thanks to the work of every associate Bosch has been recognized for awardwinning culture by the following organizations:
Indefinite U.S. work authorized individuals only. Future sponsorship for work authorization is not available.
The U.S. base salary range for this fulltime position is $95000 to $110000. Within the range individual pay is determined based on several factors including but not limited to work experience and job knowledge complexity of the role job location etc.
In addition to your base salary Bosch offers a comprehensive benefits package that includes health dental and vision plans; health savings accounts (HSA); flexible spending accounts; 401(K) retirement plan with an attractive employer match; wellness programs; life insurance; short and long term disability insurance; paid time off; parental leave adoption assistance; and reimbursement of education expenses. Learn more about our full benefits offerings by visiting: . Pay ranges included in the postings generally reflect base salary; certain positions may include bonus commission or additional benefits.
Remote Work :
No
Employment Type :
Fulltime
Full-time