- Collaborate with crossteams to perform early risk assessment and design optimization for SIP packaging products ensuring the most feasible design with best DFX for final product use.
- Define package design NUDDs and work with process/product develop team to initiate necessary new technology programs development for future product applications.
- Lead deepdive discussions on design process and productrelated procedures to address critical product requirements and drive solutions to accelerate new product TTM.
- Partner with the team to mitigate design risks through simulation and feasibility studies.
- Work with IT teams on system development including defining the Statement of Work (SOW) development conducting User Acceptance Testing (UAT) and providing training.
Qualifications :
- MS or PhD in Mechanical or Materials Engineering.
- Strong knowledge of semiconductor package design is highly desired.
- Excellent coordination skills with the ability to work effectively with crossfunction team.
- Proficient in English with strong presentation and communication skills.
- Demonstrated ability to multitask meet tight deadlines and working under pressure.
Desired Skills:
- Candidates with semiconductor packaging process and design background/experience will be mostly preferred.
Additional Information :
Because Western Digital thrives on the power of diversity and is committed to an inclusive environment where every individual can thrive through a sense of belonging respect and contribution we are committed to giving every qualified applicant and employee an equal opportunity. Western Digital does not discriminate against any applicant or employee based on their protected class status and complies with all federal and state laws against discrimination harassment and retaliation as well as the laws and regulations set forth in the Equal Employment Opportunity is the Law poster.
Remote Work :
No
Employment Type :
Fulltime