PhD Investigation of mechanical stress on MEMS substrates with on-chip MEMS StressStrain sensors fmdiv
PhD Investigation of mechanical stress on MEMS substrates with on-chip MEMS StressStrain sensors fmdiv
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Salary Not Disclosed
1 Vacancy
Job Description
- The aim is to create sensors capable of mapping the strain and stress induced on packages by environmental conditions such as temperature changes or physical bending.
- These conditions may arise from processes such as the soldering of the package to the Printed Circuit Board (PCB) or during the temperature cycles of the soldering process.
- The project involves extensive research and development work including design simulation fabrication and testing of the MEMS strain sensors.
Qualifications :
- You have a masters degree with excellent grades in a suitable field such as Microsystems Electrical Engineering Mechanical Engineering Physics Material Science or a related field
- You have a strong background in MEMS technology and FEM simulations.
- You have experience working with different domains (e.g. simulation technology and testing).
- Good English communication skills both written and verbal are required.
Additional Information :
The final PhD topic is subject to your university.
Start: according to prior agreement
Diversity and inclusion are not just trends for us but are firmly anchored in our corporate culture. Therefore we welcome all applications regardless of gender age disability religion ethnic origin or sexual identity.
Need support during your application
Michelle Kurz
Need further information about the job
Rolf Scheben
Remote Work :
No
Employment Type :
Fulltime
Employment Type
Full-time
