PCB Layout Engineer

• Hardware simulation
• Hardware debugging
• Design and develop multilayer PCBs ranging from 16 to 20 layers while ensuring optimal signal integrity power integrity and thermal considerations.
• Proficiency in routing mixedsignal circuits including FPGAbased mixed signal boards
• Schematic capture and tools
• Implement appropriate safety measures for high current and voltage (ratings between 12100V and high current ratings ranging from 200 to 500 Amps)
• Developing the PCB Layout and Design using CAD software in both Allegro and OrCAD (OrCAD Cadstar Eagle and KiCAD software development)
• Working on Footprint design & validation
• Work on Design power supplies DCDC converters power traces and Bus Bar calculations. (Component placement and wiring)
• Conduct SI (Signal Integrity) and PI (Power Integrity) analysis to ensure reliable PCB performance.
• Implement impedancecontrolled board routing DDR routing and processoronboard routing
• Develop and manage design constraints to ensure compliance with project specifications.
• Address thermal considerations in PCB designs optimizing heat dissipation and thermal performance (Thermal testing of hardware)
• Implement Design for Manufacturability (DFM) Design for Assembly (DFA) and Design for Testability (DFT) standards Utilize CAM350 Gerber validation tools for quality assurance.
• Well versed with RF fundamentals guidelines
• Highspeed digital fundamentals
• Documentation as per ISO companys guidelines
• Perform other duties as necessary.

• 4 to 6 years of experience in Multilayer(16 to 20 Layers) mixed signal routing FPGA based mixed signal boards High speed layout EMI/EMC compliant practices.
• 2 years of experience in 12100V and 200 to 500 Amps rating.
• Must be strong in both Allegro and OrCAD 17.x
• Experience in power supplies DCDC converters power traces Bus Bar calculation High voltage / High current isolation
• Must have hands on experience in Impedance controlled board routing DDR routing processor on board routing handson.
• Must be strong Knowledge on rules creation in Constraint.
• Must have strong experience in SI(Signal Integrity) analysis.
• Must have strong knowledge in PI(Power Integrity) analysis.
• Strong knowledge on the thermal consideration on the designs.
• Should have the thorough understanding of creepage and clearance and how to avoid during the design.
• Understanding of PCB/laminate materials and electrical parameters a plus.
• Must be strong in IPC standards Library footprint creation.
• Very good work experience on Complex and multilayer boards.
• Very good experience in DFx standards (DFM / DFA / DFT).
• Must have working experience in Stacked and complex boards with high layer count.
• Must be strong in Constraints Driven methodology.
• Strong experience in CAM350 Gerber validation tool.
• Selfdriven motivated and show high productivity in PCB design and development

• BE/B Tech in ECE/EEE/EE

• 46 years

dfx standards,thermal considerations,fpga,design for manufacturability,kicad,routing,dfma,schematic capture,dc-dc converters,rf fundamentals,hardware debugging,pcb,signal integrity,electrical parameters,highspeed digital fundamentals,design for assembly,cad software,power integrity analysis,power integrity,mixed signal routing,footprint design,power supplies,signal,dfa,signal integrity analysis,orcad,constraint driven methodology,mixed signal,hardware simulation,cam350 gerber validation,ipc standards,complex and multi-layer boards,allegro,design for testability,pcb layout,documentation as per iso standards