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Senior Mechanical Design Engineer Electronics Packaging

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Job Location drjobs

New York, NY - USA

Monthly Salary drjobs

Not Disclosed

drjobs

Salary Not Disclosed

Job Description

Job Title: Senior Mechanical Design Engineer (Electronics Packaging)
Job Duration: 12 Months contract on W2
Job Location: Elma New York 14059 (Hybrid)
Note: US Citizenship or Permanent Resident is required.
Job Description:
  • Develop qualify and transition to market best in class aviation electronics flight hardware
  • Design and analyze the structural and thermal performance of electronic systems.
  • Provide technical leadership to personnel supporting the assigned project
  • Participate in proposal development as a mechanical packaging expert steering the mechanical design thermal vibration and other environmental design philosophy in the preferred direction and advising team members of the risks related to trade study choices.
  • Develop and/or review design concepts CAD models ICDs and assembly drawings.
  • Assure proper documentation of technical data generated for the assigned projects and / or tasks consistent with engineering policies and procedures
  • Prepare data items for projects including thermal vibration mechanical tolerance and others
  • Be responsible for meeting cost schedule and technical requirements.
  • Participate as a presenter or reviewer in technical and program reviews.
Basic Qualifications:
  • Bachelors degree in Mechanical Engineering from an accredited institution
  • Minimum 5 years of experience in mechanical design and analysis of complex mechanical systems. Electronics systems experience is a plus.
  • Ability to access United States Export Controlled information.
Preferred Qualifications include:
  • Experience in the Aerospace industry
  • Proficiency in the use of NX or other modern solid modelling tools for complex 3D part and assembly modeling
  • Proficiency in ANSYS (Finite Element Analysis (FEA)
  • Familiarity with ANSYS ICEPAK (CFD / thermal analysis)
  • Familiarity with ANSYS Sherlock
  • Capable of performing steady state and transient thermal analysis using FEA software such as ANSYS Workbench
  • Have an understanding of shock and random vibration as it relates to electronic boxes and PCBs.
  • Experience performing deflection and vibration analysis on printed circuit cards (PCB)
  • Knowledgeable in the application and interpretation of GD&T principles in ASME Y14.5
  • Proficiency in Worst Case RSS and 6Sigma tolerance analysis of mechanical parts
  • Demonstrated proficiency in the creation and composition of engineering drawings according to applicable Industry standards using modern CAD drafting tools
  • Familiarity with basic electrical engineering principles and the application and use of electrical connectors and other interconnect products.
  • Experience designing and creating solid 3D models using CAD software (prefer UG Unigraphics experience)
  • Experience interpreting customer requirements and familiarity with industry standards
  • Have an understanding of tolerance stack up analysis
  • Experience with solder fatigue analysis.

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Employment Type

Full Time

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