Process Engineer - Heterogeneous Integration

LIGENTEC is a young dynamic and strongly growing company headquartered in Lausanne Switzerland near EPFL close to the shore of Lake Geneva. We are developing Photonic Integrated Circuits (PICs) to worldleading performance with our customers for applications in Quantum Technologies LiDAR Space Biosensors and more.

To support our growth we are looking for a:

Process Engineer
Heterogeneous Integration

Tasks

Within LIGENTECs engineering team our mission is to bring our integrated photonics platform to the next level building on its worldclass passive photonics and extending the functionality with active component integration.

Role and Responsibilities

You are part of an interdisciplinary project team that integrates active functionalities such as modulators photodiodes and amplifiers onto LIGENTECs stateofthe art passives platform.

• Develop new processes for new electrooptic modulators including thinfilm lithium niobate integration or other materials on SiN. To this end you:
• Define and execute Design of Experiments at the cleanroom facilities.
• Contribute to the project technology roadmap from a process development perspective.
• Stay up to date with stateofthe art process technology development on active components.
• Increase the maturity level of developed processes in order to release them for early customer engagements. To this end you:
• Implement statistical process control and physical model fitting of optoelectrical device properties.
• Execute fabrication runs for photonic integrated circuits for internal and external customers.
• Documentation of results with strong emphasis on correlations between optical and electrical properties of integrated actives.
• Contribute to the R&D and Process teams in all aspects especially process integration topics.

Requirements

• Masters degree in electrical chemical physical or nano engineering.
• Min of 3 years experience in relevant environments (MEMS Semiconductors NanoOptics) with handson experience on clean room processes such as wafer bonding lithography etching metallization different material deposition and characterisation techniques.
• Experience with heterogeneous integration techniques like wafer bonding microtransfer printing or flipchip assembly is a plus.
• Understanding of photonic devices like modulators photodiodes and lasers is a plus.
• Knowledge of python for statistical data analysis is a plus.
• Excellent technical problemsolving skills
• Open minded critical and innovative.
• Ability to work independently and with remote teams.
• Working proficiency in English.

Benefits

• A flexible and dynamic startup work environment.
• Be a member of an international diverse customerfocused and highly motivated team.
• Personal responsibility in your job and the chance to grow with us
• Our passion to bring PICs to everyday life.

We look forward to receiving your full application including 1) your CV 2) a statement of interest (relating the position to your skills) and 3) grade or work certificates. Noncomplete applications may not be considered.