Title:Senior Staff Packaging Engineer
Location :San Jose CA 95138
pay Rate:170000
Salary: $ 170000.00
We have partnered with a semiconductor manufacturing firm in the San Jose CA area to provide them with a Senior Staff Packaging Engineer. Please review the below description and let us know if you are interested.
Prioritized Must Have Skills for the Senior Staff Packaging Engineer:
#1. Minimum of 12 years experience in semiconductor packaging technology.
#2. Experience leading multidie packages.
#3. Organic laminate technologies manufacturing and supplier capabilities.
Responsibilities of the Senior Staff Packaging Engineer:
- Responsible for defining substrate/package design rules process flow and material set for new automotive power module packages
- Drive alignment between module substrate (PCB) design requirements and supplier capabilities to enable new product development and volume manufacturing of power modules
- Develop new assembly technologies run process DOEs to define process windows for new package development
- Drive reliability testing and qualification of new automotive module packages in conjunction with the reliability group
- Work closely with offshore assembly and substrate partners to develop new processes
- Work closely with IC design teams to define package design rules and define packages to meet their requirements
- Collaborate with multifunctional teams within Power Integrations for successful development qualification and production ramp of new module products
Requirements of the Senior Staff Packaging Engineer:
- BS Degree in Electrical Engineering Mechanical Engineering Material Science.
- Minimum experience 12 years in semiconductor packaging technology.
- Experience leaded multidie packages.
- Understanding of organic laminate technologies manufacturing and supplier capabilities.
- Experience in SMT or passive integrated package assembly is a plus.
- Experience with packaging processes: Wafer Backgrinding Wafer Dicing Die Attach Wirebonding Molding and Package Singulation. (Flip Chip is a plus)
- Experience with package substrate design rules tools (including AutoCAD).
- Knowledge of AEQ Automotive reliability requirements.
- Knowledge of APQP automotive development process
- Knowledge of JEDEC/IPC design standards.
- Ability to setup Design Rule Checks for verification of every aspect of the PCB layout a plus.
- Travel to Asia to attend technology reviews and resolve subcon/supplier issues
Other Key Requirements:
- 100% in office
- Must be able to travel to Asia.
- No sponsorship or Visa holders. No CorptoCorp.
Benefits of the Senior Staff Packaging Engineer:
- Medical Insurance
- Dental Insurance
- Vision Insurance
- Short & LongTerm Disability Insurance
- 401(k) Plan
#LIMH1