Chemical Analysis Jobs in Batu

Solder Joint Analysis (SJA) for NPI and sustaining testing phaseUtilize FA tools such as Xray oscilloscope curve tracer microscope CSAM SEM EDX TDR crosssectioning dye/pull techniques and more for detailed analysis.Generate SJA summaries based on findings and provide detailed reports More...

Solder Joint Analysis (SJA) for NPI and sustaining testing phaseUtilize FA tools such as Xray oscilloscope curve tracer microscope CSAM SEM EDX TDR crosssectioning dye/pull techniques and more for detailed analysis.Generate SJA summaries based on findings and provide detailed reports More...

Solder Joint Analysis (SJA) for NPI and sustaining testing phaseUtilize FA tools such as Xray oscilloscope curve tracer microscope CSAM SEM EDX TDR crosssectioning dye/pull techniques and more for detailed analysis.Generate SJA summaries based on findings and provide detailed reports More...

Perform package and PCBA  assembly test defect from production qualification on semifinished or finished products. Define FA flow for each FA case. Generate FA report and assist process engineer for rootcausing of defect/s. SME on key FA equipment maintain the FA tracking and FA More...

Perform package and PCBA  assembly test defect from production qualification on semifinished or finished products. Define FA flow for each FA case. Generate FA report and assist process engineer for rootcausing of defect/s. SME on key FA equipment maintain the FA tracking and FA More...

Perform package and PCBA  assembly test defect from production qualification on semifinished or finished products. Define FA flow for each FA case. Generate FA report and assist process engineer for rootcausing of defect/s. SME on key FA equipment maintain the FA tracking and FA More...

Responsibilities:Conduct electrical failure analysis for manufacturing quality and customer failure drives for both NPI and sustaining products.Identify the root cause of failures including hardware (NAND ASIC PMIC DDR) firmware assembly process etcCollaborate with subject matter expe More...

Responsibilities:Conduct electrical failure analysis for manufacturing quality and customer failure drives for both NPI and sustaining products.Identify the root cause of failures including hardware (NAND ASIC PMIC DDR) firmware assembly process etcCollaborate with subject matter expe More...

Responsibilities:Conduct electrical failure analysis for manufacturing quality and customer failure drives for both NPI and sustaining products.Identify the root cause of failures including hardware (NAND ASIC PMIC DDR) firmware assembly process etcCollaborate with subject matter expe More...

Perform analysis on integrated package and PCBA assembly Test defect from production and qualification on semifinished or finished products.Read and understand the test data log.Perform analysis using FA tools such as Xray oscilloscope  curve tracer microscope CSAM SEM EDX TDR cr More...

Perform analysis on integrated package and PCBA assembly Test defect from production and qualification on semifinished or finished products.Read and understand the test data log.Perform analysis using FA tools such as Xray oscilloscope  curve tracer microscope CSAM SEM EDX TDR cr More...

Perform analysis on integrated package and PCBA assembly Test defect from production and qualification on semifinished or finished products.Read and understand the test data log.Perform analysis using FA tools such as Xray oscilloscope  curve tracer microscope CSAM SEM EDX TDR cr More...

Maximize COP process capability to handle wide range of product portfolio.Drive for COP process yield improvement and monitoring.Drive for COP related test QDN investigation and improvement plan.Drive COP improvement projects.New product recipe development and low More...

Maximize COP process capability to handle wide range of product portfolio.Drive for COP process yield improvement and monitoring.Drive for COP related test QDN investigation and improvement plan.Drive COP improvement projects.New product recipe development and low More...

Maximize COP process capability to handle wide range of product portfolio.Drive for COP process yield improvement and monitoring.Drive for COP related test QDN investigation and improvement plan.Drive COP improvement projects.New product recipe development and low More...

ESSENTIAL DUTIES AND RESPONSIBILITIES:Defines IC package/SMT/SSD drive requirements goals and milestones for all SSD product groups and customer requirements.Develops SSD assembly and IC packaging material and processes to meet quality reliability cost yield productivity and manufactu More...

ESSENTIAL DUTIES AND RESPONSIBILITIES:Defines IC package/SMT/SSD drive requirements goals and milestones for all SSD product groups and customer requirements.Develops SSD assembly and IC packaging material and processes to meet quality reliability cost yield productivity and manufactu More...

ESSENTIAL DUTIES AND RESPONSIBILITIES:Defines IC package/SMT/SSD drive requirements goals and milestones for all SSD product groups and customer requirements.Develops SSD assembly and IC packaging material and processes to meet quality reliability cost yield productivity and manufactu More...

In this position the individual will be responsible on execution and analysis of NAND memory reliability qual and perform Failure Analysis. This involves designing and developing reliability sequences for given technology node in addition to performing actual reliability test executio More...

In this position the individual will be responsible on execution and analysis of NAND memory reliability qual and perform Failure Analysis. This involves designing and developing reliability sequences for given technology node in addition to performing actual reliability test executio More...