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Role: ASIC Package Engineer SI/PI Engineer
Location: Remote
Interview: Phone/Skype
Job Type: Contract
Job Description: Experienced ASIC Packaging Engineer focusing on Signal Integrity and Power Integrity to support the development of custom ASICs.
Responsibilities:
Drive chippackagesystem codesign by driving signal and power integrity requirements analysis and optimization.
Define power tree structure and netlists for High Performance Computing based on 2.5D/3D package technology.
Run prelayout and postlayout simulation flow for highspeed interface and PDN.
Develop SIPI validation methodology and detailed engineering test plans.
Validate highspeed interface and PDN impedance in lab.
Collaborate with Architecture ASIC Mixed Signal Package and PCB Design teams.
Perform package/board power delivery network ACDC simulation.
Develop nextgen memory interface considering IO PHY SI/PI and physical design.
Skills: #SIPI #ASICPackaging #HighSpeedInterface #PowerTree #Simulation #Validation #Electromagnetics #MIPI #PCIe #CadenceSigrity #PowerSI #AnsysSIwave #KeysightADS #3DLayout #AnsysHFSS
Eligibility Criteria:
Genuine H1B candidates with verifiable I94 travel history (C2C acceptable).
Green Card & US Citizens will be considered only on W2 payment terms.
If you or someone you know is a strong match lets connect immediately!
Additional Information :
All your information will be kept confidential according to EEO guidelines.
Remote Work :
Yes
Employment Type :
Contract
Remote