drjobs Principal Engineer Packaging Engineering

Principal Engineer Packaging Engineering

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1 Vacancy
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Job Location drjobs

Bengaluru - India

Monthly Salary drjobs

Not Disclosed

drjobs

Salary Not Disclosed

Vacancy

1 Vacancy

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

  • Represents Package Engineering in crossfunctional teams and ensures that packages are characterized qualified and introduced into production in a timely manner while meeting all mechanical electrical performance reliability and quality requirements.        
  • Working with crossfunctional teams factories and other engineers manages the entire package life cycle process.          
  • Coordinates with factories and contract manufacturers worldwide on the high volume introduction of new packages and assembly processes.           
  • Works with the Packaging R&D teams worldwide to develop and qualify new and emerging packaging technology required to support business needs
  • Manages assembly yield improvement and package cost reduction programs  
  • Responsible for maintaining package roadmaps budgets for the product lines supported and building packaging infrastructure 
  • Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA SOD Control Plan recipe guideline SPC and other assembly controls are ready prior to high volume production.
  • Collaborate extensively with internal teams validate design options through characterization builds perform comprehensive DFX (Design for exellence) analysis including DFM (Design for Manufacturability) DFA (Design for Assembly) DFRW (Design for Rework

Qualifications :

  • Masters degree or PhD in Material Science Manufacturing Mechanical Engineering Computer Science Physics or other engineering disciplines.
  • Masters degree with more than 8 years of relevant work experience or PhD degree with over 6 years of work experience. Bachelors with 10 Years.
  • Proficient understanding of packaging domains such as SMT PCBA solder joint reliability board level reliability packaging materials failure analysis and PCB layout. Additional knowledge in areas like die attach wire bond wafer thinning and molding is a plus.
  • Knowledge in Machine learning and data analytics utilizing AI is a plus.
  • Exceptional problemsolving skills with expertise in experimental design and statistical analysis.
  • Excellent written and communication skills enabling collaboration with global functional teams.
  • Knowledge of thermomechanical aspects of semiconductor packages and SolidState Drives

 


Additional Information :

Western Digital is committed to providing equal opportunities to all applicants and employees and will not discriminate based on their race color ancestry religion (including religious dress and grooming standards) sex (including pregnancy childbirth or related medical conditions breastfeeding or related medical conditions) gender (including a persons gender identity gender expression and genderrelated appearance and behavior whether or not stereotypically associated with the persons assigned sex at birth) age national origin sexual orientation medical condition marital status (including domestic partnership status) physical disability mental disability medical condition genetic information protected medical and family care leave Civil Air Patrol status military and veteran status or other legally protected characteristics. We also prohibit harassment of any individual on any of the characteristics listed above. Our nondiscrimination policy applies to all aspects of employment. We comply with the laws and regulations set forth in the Equal Employment Opportunity is the Law poster.

Western Digital thrives on the power and potential of diversity. As a global company we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees our company our customers and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at to advise us of your accommodation request. In your email please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.


Remote Work :

No


Employment Type :

Fulltime

Employment Type

Full-time

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