Position Overview:
We are seeking a Principal Engineer to join our team in Grenoble. This role will focus on investigating and developing advanced technologies in electromagnetic thermomechanical and physicochemical simulation modeling for complex modules particularly at their interfaces. The position will also involve utilizing insitu nondestructive testing technologies.
Leading Engineering Projects
- Research and explore innovative technologies related to electromagnetic thermomechanical and physicochemical simulation modeling of complex modules especially focusing on interfaces like BLT/TIM and underfill employing insitu nondestructive techniques.
- Provide technical insights into emerging technology trends and apply these insights to enhance client hardware products.
- Collaborate with local and Chinese teams to tackle upcoming challenges and assist in the preparation of specifications and design documents.
Essential Skills and Experience
- Extensive knowledge of microelectronics packaging module substrate processes and overall module processing with the ability to independently conduct multiphysical field and multiscale simulations and modeling for complex module packaging.
- Proficient in multiscale and multiphysical field simulation modeling in electrical magnetic thermal and mechanical domains with a solid understanding of reliability packaging challenges such as warpage stress management thermomigration electromigration and heat dissipation.
- Strong understanding of material properties for essential layers like PCB TIM substrate and underfill along with their implications for overall integration.
- Significant experience with industrial simulation software such as COMSOL or HFSS; familiarity with Python coding is a plus.
- Ability to work effectively both in teams and independently along with strong communication skills for collaborating within a diverse group.
- Must be eligible to work in the European Union for this position.
- Fluency in English is required.
Benefits
- An opportunity to work on innovative projects and technologies in a dynamic environment.
- Collaboration with international teams to address significant challenges in microelectronics.
- Professional development and growth within an industryleading company.
- Competitive salary and comprehensive benefits package.
If you are a visionary engineer with a passion for technological advancement and team leadership we invite you to apply. Click Apply Now to submit your CV and a cover letter showcasing your expertise and eagerness to lead pioneering engineering projects.
Commitment to Diversity and Inclusion
Our company is dedicated to promoting a diverse and inclusive workplace. We encourage applications from individuals of all genders ethnicities and backgrounds. Diversity not only enriches our team but also propels our innovation and success.