Senior Chip Packaging Engineer
Senior Chip Packaging Engineer
Posted on :
16-11-2024
Employer Active
1 Vacancy
Job Alert
You will be updated with latest job alerts via emailValid email field required
Send jobs
Share
Send me jobs like this
Job Alert
You will be updated with latest job alerts via emailValid email field required
Send jobs
Job Description
We are working with a design company and as part of their continued growth NodeFlair has been engaged to search for Senior Chip Packaging Engineer to join their Singapore team.
The package is competitive at SGD 84k 126k / year (excluding bonus).
Responsibilities:
Requirements:
- Bachelors or higher in Electronic Engineering Microelectronics Computer Science or related field.
- 5 years in packaging design or project development.
- Strong communication coordination and teamwork skills.
- English and Chinese proficiency is a plus.
Interested applicants please contact Ayla at for a confidential discussion.
EA License No: 19S9830
Employment Type
Full Time
Key Skills
Report This Job
Disclaimer: Drjobpro.com is only a platform that connects job seekers and employers. Applicants are advised to conduct their own independent research into the credentials of the prospective employer.We always make certain that our clients do not endorse any request for money payments, thus we advise against sharing any personal or bank-related information with any third party. If you suspect fraud or malpractice, please contact us via contact us page.
