Description:
*Please note: This is an onsite role 100% of the time.
Laptop will be issued for this role.
Interviews are conducted.
The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
Skill sets required not limited to the following:
Demonstrated skills in Xsection/planar polishing Optical microscopy imaging and SEM/EDX on printed circuit board are preferred. Knowledge of packaging material property and behavior is beneficial.
Candidate must also demonstrate good verbal and technical writing skills work well with a team deliver under pressure and well organized.
Minimum educational qualification is an AS degree in science or engineering and 24 years experience in failure analysis material analysis process development or analytical tool development. Must be able to stand and work for at least 6 hours.
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Additional Details
- Managers Requested Bill Rate : 39.30
- Does the position allow for the worker to be virtual/remote : No
- Shore Options Available for this Position : Onshore Only
- Critical Position : No
- PO Number (Intel Federal and Construction Only) : Enter PO here if applicable
- Shift Hours : 8am5pm
- Shift Days : MondayFriday
- Intel Specific Job Title : (No Value)
- Project ID : QNR Engineering