Staff Thermal Engineer
Posted on :
04-06-2024
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Job Description
- Perform thermal analysis on package substrates PCBs and enclosures
- Setting up mechanical models in Ansys Icepack or Flotherm from Cadence layout designs
- Understanding of thermal models (such as lumped 2R 4R resistor model) or distributed model for system level simulations
- Be able to define thermal requirements during architecture phase for packages and PCBs
- Design of heatsinks heat spreaders and fans to dissipate heat
- Work with external vendors to tool and manufacture the thermal solutions
- Be able to measure thermal gradients in lab and correlate the simulations for actual measurements
- Good understanding of package PCB designs stack up and material properties
- Be able to calculate the air flow requirements needed to achieve target junctions temperatures
- Be able to use APD and Cadence PCB editor to navigate through the layout and modify the design to optimize the thermal performance
- Should have basic understanding of electrical thermal mechanical requirements for the packages and PCBs. Know basic manufacturing processes used to fabricate the packages and PCB
- Bachelors plus 5 10 years of industry related experience
We are 26 years old company catering to top notch companies catering to Semicon Industries Telecom and System Software. We are operating out of Delhi Bengaluru and Hyderabad.
Employment Type
Full Time
Company Industry
Key Skills
- Computer Science
- Docker
- Kubernetes
- Python
- VMware
- C/C++
- Go
- System Architecture
- gRPC
- OS Kernels
- Perl
- Distributed Systems
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