Senior Staff Packaging Engineer Power

Drive Semiconductor Packaging Innovation – Senior Packaging Engineer Opportunity

Nexus Semiconductor is seeking a highly skilled packaging expert to join our client a force in the power semiconductor industry. This is an extraordinary opportunity to shape the future of packaging technologies for highperformance highreliability applications across industrial datacoms telecoms and consumer devices.

The Client
Our client is at the forefront of power management solutions developing groundbreaking products that push the boundaries of performance and efficiency.

Your Mission

• Packaging Visionary: Architect and implement cuttingedge packaging process flows essential for highvolume production and exceptional reliability.
• Technical Strategist: Develop a forwardlooking packaging roadmap aligned with the company's ambitious product vision.
• CrossFunctional Leader: Collaborate closely with chip architects from ideation to product launch ensuring optimized designs for peak performance.
• Design Optimizer: Utilize simulation tools to model parasitics thermal dissipation mechanical stress and guide design teams towards ideal solutions.
• Supply Chain Strategist: Build strong partnerships with key players including wafer fabs OSATs and test organizations.

• Extensive Experience: 812 years in power semiconductor packaging with 2 years of project/technical leadership.
• Deep Technical Expertise: Mastery of advanced packaging technologies (WLCSP FCOL CuP MCM embedded die etc.) and a strong power semiconductor background.
• Analytical Mindset: Exceptional critical thinking skills and ability to identify potential problems and solutions during the design and qualification phases.
• Process Innovator: Experience in all aspects of semiconductor manufacturing from wafer processing to final product assembly.
• Simulation Savvy: Proficiency with design and simulation tools for assessing product integrity.

• Recent experience in DCDC power packaging development
• Experience with SiPower management IC packaging (10x10mm die with extensive pins) using CuPillar Lead Frame QFN
• Expertise in 2D & 3D CAD (Autodesk Inventor SolidWorks etc.) and FEA simulation tools (ANSYS Workbench)

• Competitive Compensation: USDper year
• Make Your Mark: Play a pivotal role in transforming power semiconductor packaging.
• Powerhouse Team: Join a team of innovators dedicated to delivering stateoftheart solutions.
• CuttingEdge Environment: Work with the latest technologies and drive advancements in the field.

Ready to power up the future of semiconductor packaging Apply today through Nexus Semiconductor!

Company Note: Nexus Semiconductor is an equal opportunity employer committed to diversity and inclusion. We welcome talent from all backgrounds.